The FPA30M32917T is a 320×256 InGaAs image sensor with a 2-stage TEC, optimized for 0.9–1.7µm near-infrared imaging. It offers >99.5% pixel operability and >70% quantum efficiency for high-precision imaging applications.
FPA30M32917T
Description
The FPA30M32917T is a high-performance InGaAs image sensor designed for near-infrared imaging in the 0.9–1.7µm spectral range. Built in a 28-pin metal DIP package and equipped with an embedded 2-stage thermoelectric cooler (TEC), the sensor provides enhanced thermal stability, ensuring consistent performance even under demanding operating conditions.
Delivering >99.5% pixel operability and >70% quantum efficiency, the FPA30M32917T offers superior sensitivity and reliability for advanced imaging systems. This makes it an excellent choice for spectroscopy, industrial inspection, scientific research, and telecommunication applications.
Features
- 320×256 array format
- 0.9–1.7µm spectral range
- 28-pin metal DIP package
- Embedded 2-stage thermoelectric cooler (TEC)
- Typical pixel operability >99.5%
- Quantum efficiency >70%
Applications
- Near-infrared imaging
- Imaging spectroscopy
- Covert surveillance
- Semiconductor inspection
- Medical science and biology
- Fiber optic telecommunication
- Astronomy and scientific research
- Industrial thermal imaging
- Moisture mapping
Additional information
| Status | Active |
|---|---|
| Number of Effective Pixels | 320×256 |
| Pixel Size | 30umx30um |
| Pixel Pitch | 30um |
| Image Size | 9.6mmx7.68mm |
| Spectral Response Range | 900-1700nm |
| Frame Rate | 346fps |
Documentation
Data Sheet
[PDF] FPA30M32917T – 0.9–1.7µm 320×256 Near-IR InGaAs Image Sensor with 2-Stage TEC Product Datasheet