The FPA30M32917C is a 320×256 InGaAs near-infrared image sensor with 1-stage TEC, optimized for 0.9–1.7µm spectral range, offering >99.5% pixel operability and >70% quantum efficiency for reliable imaging and inspection.
FPA30M32917C
Description
The FPA30M32917C is a high-performance 320×256 InGaAs image sensor designed for near-infrared imaging across the 0.9–1.7µm spectral range. Packaged in a 28-pin metal DIP with an embedded 1-stage thermoelectric cooler (TEC), the sensor ensures stable performance under varying environmental conditions.
With >99.5% pixel operability and >70% quantum efficiency, this sensor delivers precise, low-noise imaging for demanding applications in inspection, telecommunications, spectroscopy, and scientific research. Its robust design makes it well-suited for integration into advanced imaging systems.
Features
- 320×256 array format
- 0.9–1.7µm spectral range
- 28-pin metal DIP package
- Embedded 1-stage thermoelectric cooler (TEC)
- Typical pixel operability >99.5%
- Quantum efficiency >70%
Applications
- Near-infrared imaging
- Imaging spectroscopy
- Covert surveillance
- Semiconductor inspection
- Medical science and biology
- Fiber optic telecommunication
- Astronomy and scientific research
- Industrial thermal imaging
- Moisture mapping
Additional information
| Status | Active |
|---|---|
| Number of Effective Pixels | 320×256 |
| Pixel Size | 30umx30um |
| Pixel Pitch | 30um |
| Image Size | 9.6mmx7.68mm |
| Spectral Response Range | 900-1700nm |
| Frame Rate | 346fps |
Documentation
Data Sheet
[PDF] FPA30M32917C – 0.9–1.7µm 320×256 Near-IR InGaAs Image Sensor with 1-Stage TEC Product Datasheet