FPA30M321222T

Description

The FPA30M321222T is a high-performance 320×256 InGaAs focal plane array optimized for shortwave-infrared (SWIR) imaging in the 1.2–2.2µm spectral range. Housed in a 28-pin metal DIP package with an integrated 2-stage thermoelectric cooler (TEC) and built-in temperature sensor, this device ensures stable operation and consistent image quality across demanding environments.

Featuring a minimum pixel operability of >98% and quantum efficiency >65%, the FPA30M321222T delivers high sensitivity and precision for a wide range of imaging and sensing applications. With support for snapshot ITR/IWR and IMRO readout modes, multi-channel outputs (1, 2, or 4) up to 10MHz pixel rate, and windowing capability, it provides excellent flexibility for integration into scientific, industrial, and defense imaging systems.

Features

• 320×256 array format
• 1.2–2.2µm spectral range
• 28-pin metal DIP package
• Embedded 2-stage thermoelectric cooler (TEC)
• Built-in temperature sensor
• Minimum pixel operability >98%
• Quantum efficiency >65%
• Snapshot ITR/IWR and IMRO readout modes
• 1, 2, or 4 outputs with up to 10MHz pixel rate
• Windowing capability

Applications

• Shortwave-infrared (SWIR) imaging
• Hyper/multi-spectral imaging
• Semiconductor inspection and process monitoring
• Medical science and biology
• Fiber optic assembly and testing
• Imaging through fog/smoke
• Astronomy and scientific research
• Ice, slush, and moisture mapping
• Laser beam profiling
• Sorting and recycling